| 型号 | 制造商 | 描述 | 操作 |
| ZSSC3170FE1B [更多] | Integrated Device Technology Inc | Automotive Sensor Signal Conditioner with LIN and PWM Interface -40 to 150°C Die Unsawn on Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSSC3170FE1B) RoHS: Compliant | 搜索 |
