| 型号 | 制造商 | 描述 | 操作 |
| ZSC31014EAB [更多] | Integrated Device Technology Inc | RBiciLite Digital Output Sensor Signal Conditioner -40 to 125°C Die Unsawn on Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSC31014EAB) RoHS: Compliant | 搜索 |
| ZSC31014EAB [更多] | Integrated Device Technology Inc | RBiciLite Digital Output Sensor Signal Conditioner -40 to 125°C Die Unsawn on Wafer (Alt: ZSC31014EAB) RoHS: Compliant | 搜索 |
