| 型号 | 制造商 | 描述 | 操作 |
| SIDC59D170HX1SA2 [更多] | Infineon Technologies AG | DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC59D170HX1SA2) RoHS: Compliant | 搜索 |
| SIDC59D170HX1SA2 [更多] | Infineon Technologies AG | DIODEN CHIPS (Alt: SIDC59D170HX1SA2) RoHS: Compliant | 搜索 |
