RE470-01 [更多] | Roth Elecronik GmbH | Prototyping board Dimensions L x W: 35.5 x 35.5 mm Housing size: QFP 80 (0.40 mm), QFP 40, 48 (0.50 mm) Copper lamination: 35μm Double Sided, Plated Through Material type: FR4 Epoxide + chem. Au Pitch: 2.54 mm Board thickness: 1.5 mm | 搜索 查看资料 |