RE460-01 [更多] | Roth Elecronik GmbH | Prototyping Board Dimensions L x W: 44.5 x 37.7 mm Housing size: QFP 32, 80 (0.80 mm), QFP 64 (0.50 mm) Copper lamination: 35um Double Sided, Plated Through Material type: FR4 Epoxide + chem. Au Pitch: 2.54 mm Board thickness: 1.5 mm | 搜索 查看资料 |