| 型号 | 制造商 | 描述 | 操作 |
| ECF620AAACN-C2-Y3 [更多] | Micron Technology Inc | LPDDR3 6G DIE 192MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF620AAACN-C2-Y3) RoHS: Compliant | 搜索 |
| ECF620AAACN-C2-Y3-ES [更多] | Micron Technology Inc | LPDDR3 6G DIE 192MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF620AAACN-C2-Y3-ES) RoHS: Compliant | 搜索 |
