| 型号 | 制造商 | 描述 | 操作 |
| BXSTS200P 915972 [更多] | Intel Corporation | CPU & Chip Coolers Heat Sink For LGA2011
| 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| BXSTS200P 915972 [更多] | Intel Corporation | Boxed Passive Thermal Solution 25.5mm Heat Sink for 1U Non-Intel Chassis - Boxed Product (Development Kits) (Alt: BXSTS200P 915972) RoHS: Compliant | 搜索 |
| BXSTS200P 915972 [更多] | Intel Corporation | Boxed Passive Thermal Solution 25.5mm Heat Sink for 1U Non-Intel Chassis (Alt: BXSTS200P 915972) RoHS: Compliant | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| BXSTS200P 915972 [更多] | Intel Corporation | Unidentified
| 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| BXSTS200P 915972 [更多] | Intel Corporation | Passive Thermal Solution BXSTS200P, Single RoHS: Compliant | 搜索 |
| 型号 | 制造商 | 描述 | 操作 |
| BXSTS200P 915972 [更多] | Intel Corporation | Passive Thermal Solution BXSTS200P, Single RoHS: Compliant | 搜索 |
| BXSTS200P 915972 [更多] | Intel Corporation | Passive Thermal Solution BXSTS200P, Single RoHS: Compliant | 搜索 |
