conga-QMX6/HSP1
制造商型号: conga-QMX6/HSP1
制造商: congatec描述: Heat Sinks Standard heatspreader (with 1mm Gap Pad) for Qseven module conga-QMX6 with CPU in LIDDED FCBGA package. Intended for following QMX6 modules: conga-QMX6/iDC-1G eMMC2 (P/N 016112) conga-QMX6/iQC-1G eMMC2 (P/N 016113)
技术参考: PDF查询库存状态: 实时库存查询 所在地:深圳全新原装现货
备注: 代理销售世界各大品牌电子元器件,大量全新原装正品现货
订购热线: 400-900-3095, QQ:
800152669, Email:
sales@szcwdz.com